Large-area LCD driver ICs are mostly made with the 110nm to 300nm process node of 8-inch wafers, while smartphone LCDs and OLED driver ICs are mostly made with the 28nm to 90nm process node of 12-inch wafers.
Display Dynamics – January 2022: Display driver ICs versus wafer foundry nodes and applications
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The Analyst Team
David Hsieh
Senior Research Director, Components & Devices: Displays
David Hsieh is an expert in the TFT LCD, OLED, LCD TV, and smartphone display value chain for mainland China, Taiwan, Japan, and Korea. David is head of the Displays team and oversees the division’s end-to-end research on displays, covering the supply chain, materials, components, supply and demand dynamics, pricing, cost modeling, revenue and shipment forecasts, and emerging technologies.
In 2019, David and his leading display research analysts team joined Omdia from IHS Markit. Prior to Omdia, David was named as one of just 11 technology fellows by IHS Markit an honor that recognizes his deep expertise and exceptional standing within the analyst community. He is a graduate of Chung-Yuan Christian University in Taiwan and has a bachelor’s degree in industrial engineering. David also holds a master’s degree in business administration from Preston University, Wyoming, US. David is a fluent speaker of Chinese, Taiwanese, Japanese, and English.
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