This report takes Omdia's forecasts for silicon carbide devices and uses them to assess the demand for wafers into the future. It contains one year of historical data (2023), the base year (2024), and 10 years of forecast data (2025–34).
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The Analyst Team

Callum Middleton
Follow AnalystPrincipal Analyst, Power Semiconductors
Callum works on the power electronics service, and more specifically, the power electronics discretes and modules report. Using the team’s expertise and connections to the industry, he presents high-quality data on a wide range of discrete and module types, which is broken down to give supportive insights.
Callum graduated with a doctorate from the University of Bristol in 2018, specializing in materials science and the physics of semiconductor devices. Upon graduation, Callum worked in the defense industry and for a research organization developing the next generation of compound semiconductor systems. This work focused on high-performance modules and packages across RF, photonics, and power electronics, with a primary focus on power modules for automotive and energy applications. Callum brings his expertise in compound semiconductors and packaging and his passion for new technology to the power electronics service, which he joined in July 2022.
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Michael (Minming) Mao
Follow AnalystSenior Analyst, Semiconductor Components
As part of Omdia’s power semiconductor team, Michael is responsible for providing research, analyses, and forecasts for power semiconductors, including new technologies like wide bandgap (SiC and GaN). He also focuses on China’s market situation and trends.
Michael has wide experience in the electronics industry, including components and applications. Prior to joining Omdia in 2023, Michael spent two years performing supplier quality management at Continental and five years conducting customer technical support at Murata. Before that, he was a design engineer that worked on power magnetic components at Tamura for two years. Michael holds a bachelor’s degree in electrical engineering from Shanghai University of Engineering Science, China. He is also a qualified VDA 6.3 auditor.
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