UHPPI LCD: Challenging OLEDoS in high-resolution VR displays

In this blog, we discuss how recent advancements in Ultra-High PPI (UHPPI) LCD technology from manufacturers like BOE and Innolux are challenging the dominance of OLED on Silicon (OLEDoS) in high-resolution displays for virtual reality (VR) and mixed reality (MR) headsets.

The Resolution Revolution in VR

In the world of virtual reality (VR) and mixed reality (MR) headsets, we’re witnessing a noteworthy shift in display technology. Although OLEDoS (OLED on Silicon) has dominated the high-resolution VR display market, LCD manufacturers such as BOE and Innolux are mounting a surprising challenge through their Ultra-High PPI (UHPPI) LCD technologies.

Why Pixel Count Matters More Than Density

In VR headsets, visual quality isn’t primarily determined by pixel density (PPI), but rather by total pixel count. This is because optical lenses decouple the physical display size from the actual viewing experience. Instead of focusing on diagonal size and pixels-per-inch metrics, VR engineers prioritize the field of view (FOV) and pixels per degree (PPD).
OLEDoS Limitations

Despite its popularity, OLEDoS technology faces significant limitations. These include strict size constraints (typically limited to around 1.3–1.4 inches) and issues related to light crosstalk, caused by minimal spacing between subpixels. Due to these size limitations and minimum pixel-size constraints, OLEDoS technology has difficulty surpassing a total pixel count of approximately 15–20 million pixels.

LCD’s Surprising Advantages

LCD technology does not face these same limitations. Recent developments from BOE and Innolux have demonstrated UHPPI LCD samples that achieve around 13–15 million pixels, surpassing even the specifications of Apple’s Vision Pro. Notably, BOE’s solution utilizes a true RGB pixel arrangement.

The larger physical size of LCD panels further reduces optical engineering challenges when expanding the field of view. Additionally, while OLEDoS relies on expensive semiconductor processes originally designed for chip manufacturing rather than displays, LCD leverages existing Gen 6 manufacturing lines. This established infrastructure offers clear advantages:

• Incremental Improvements: Achieving ultra-high pixel counts only requires incremental advancements in photolithography.
• Mass Production Efficiency: Gen 6 fabs handle substrates approximately 40 times larger than OLEDoS wafers.
• Mature Supply Chains: Long-established component ecosystems help reduce costs and streamline manufacturing.

However, LCD technology still faces challenges, such as minimizing the width of driving circuit lines and improving transparency. Nevertheless, innovations like Color Filter on Array (COA) technology are significantly enhancing resolution capabilities.

To read more insights and analysis covering market trends and industry forecasts prepared by Omdia’s Display practice, click here.