As Micro LED chip sizes and pitch get smaller, bumping technology for bonding area should get more precise. This means that the price level for individual bumping will increase as the pitch decreases. On the other hand, the price level for massive bumping will decrease.
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Display Dynamics – December 2022: Micro LED bumping technology is improving in precision
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The Analyst Team
Jerry Kang
Follow AnalystPractice Leader, OLED, Flexible, Micro LED and Emerging Technology
Jerry Kang is the practice leader and leading analyst for the emerging display market and technology analysis. His research areas are OLED, quantum dot, micro LED, and on-silicon displays. He and his team cover the dynamics of the supply chain and the latest technology trends in equipment, materials, and components.
Before joining Omdia, formerly IHS Markit, in 2011, Jerry was an OLED development engineer at Samsung Mobile Display, where he led the company’s research of the global OLED display technology and market. With more than 20 years of industry experience, Jerry is known for his professional analysis and strategic insights on the technology and the OLED, quantum dot, micro LED, and on-silicon displays market. He is frequently quoted in the media and is a frequent guest speaker at major conferences worldwide. Jerry holds a bachelor’s degree in electronics engineering from Pusan National University in South Korea.
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