This is the 2023 Omdia analysis of GaN power semiconductor epiwafer demand. It includes four types of epiwafer substrates: GaN-on-silicon, GaN-on-sapphire, bulk GaN, and GaN-on-engineered-substrates. It spans 12 years, from 2021 to 2032. Slide no. 5 has been updated to correct a factual error.
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GaN Power Semiconductor Wafer Demand Forecast Tool – 2023 Analysis
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The Analyst Team
Richard Eden
Follow AnalystPrincipal Research Analyst, Power Semiconductors
Richard Eden is a power semiconductor market analyst whose focus includes the Power Discrete & Module Market Tracker, the Power Semiconductor Market Share Database, and the SiC & GaN Power Semiconductors Report within the power semiconductor intelligence service. He also contributes to other semiconductor reports.
Richard joined Informa (now Omdia) in 2019 after it acquired IHS Markit Technology. He started working on power semiconductor market research in 2010 at IMS Research, later bought by IHS Markit. Prior to this, Richard spent 5 years in electronics marketing management at RS Components and 15 years in various product management and sales roles at ROHM Electronics (now ROHM Semiconductor). Before that, he was a design engineer that worked on high-end microwave components and subsystems at Plessey Microwave in the 1980s. Richard has a Higher National Diploma in electronic and electrical engineering from Coventry (Lanchester) Polytechnic, now Coventry University.
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Callum Middleton
Follow AnalystPrincipal Analyst, Power Semiconductors
Callum works on the power electronics service, and more specifically, the power electronics discretes and modules report. Using the team’s expertise and connections to the industry, he presents high-quality data on a wide range of discrete and module types, which is broken down to give supportive insights.
Callum graduated with a doctorate from the University of Bristol in 2018, specializing in materials science and the physics of semiconductor devices. Upon graduation, Callum worked in the defense industry and for a research organization developing the next generation of compound semiconductor systems. This work focused on high-performance modules and packages across RF, photonics, and power electronics, with a primary focus on power modules for automotive and energy applications. Callum brings his expertise in compound semiconductors and packaging and his passion for new technology to the power electronics service, which he joined in July 2022.
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Paul Pickering
Follow AnalystPractice Lead, Research Director
Paul leads a team of research analysts covering power, automotive, industrial, MEMS and sensors, and MCUs. Paul has primary responsibility for the Power IC Market Tracker and the annual Power Semiconductors in Data Centers report.
Prior to joining Omdia, Paul was a senior analyst at IHS Markit. Before that, he spent over 30 years as an engineer in a diverse range of industries, including semiconductors, automotive electronics, flight simulation, and industrial automation. His experience includes digital and analog design, product marketing, applications, and embedded software, as well as client-side and server-side programming for internet applications. Paul was also a freelance writer with a monthly column and numerous articles in professional electronic publications. He holds a Bachelor of Science (Hons.) in applied physics and electronics from Royal Holloway College, London University.
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