AUO’s three-sided borderless chip-on-film (COF) design reduces the manufacturing cost of panels and modules significantly by eliminating side wiring. However, this solution can only assemble two vertical modules, while side wiring can assemble infinite vertical modules theoretically. AUO should focus on reducing the extra costs of Micro LED displays by manufacturing oxide TFT modules in its Gen 8.5 fab.
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Display Dynamics – April 2025: AUO has introduced a 41.6-inch single LTPS module for Micro LED displays
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The Analyst Team
Jerry Kang
Follow AnalystPractice Leader, OLED, Flexible, Micro LED and Emerging Technology
Jerry Kang is the practice leader and leading analyst for the emerging display market and technology analysis. His research areas are OLED, quantum dot, micro LED, and on-silicon displays. He and his team cover the dynamics of the supply chain and the latest technology trends in equipment, materials, and components.
Before joining Omdia, formerly IHS Markit, in 2011, Jerry was an OLED development engineer at Samsung Mobile Display, where he led the company’s research of the global OLED display technology and market. With more than 20 years of industry experience, Jerry is known for his professional analysis and strategic insights on the technology and the OLED, quantum dot, micro LED, and on-silicon displays market. He is frequently quoted in the media and is a frequent guest speaker at major conferences worldwide. Jerry holds a bachelor’s degree in electronics engineering from Pusan National University in South Korea.
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